NVIDIA Advances Co-Packaged Optics with Industry Collaboration
NVIDIA is leading the charge in transforming data-center connectivity through co-packaged optics technology. Partnering with industry leaders, the company aims to enhance energy efficiency and scalability in modern data centers. The integration of optical and electrical components is setting a new standard for high-performance systems.
Key collaborations with advanced foundry processes and fiber-to-chip specialists are driving innovation. NVIDIA's partnership with TSMC has yielded breakthroughs in Micro Ring Modulators, addressing fabrication challenges and enabling precise thermal control. These advancements are critical for meeting the growing demand for data throughput.